Polymers & Resins
Polyimide
A high-heat polymer with exceptional thermal stability and dielectric properties. It is used for flexible printed circuit substrates, aerospace insulation and high-temperature adhesive tapes, maintaining performance above 300°C.
A high-heat polymer with exceptional thermal stability and dielectric properties. It is used for flexible printed circuit substrates, aerospace insulation and high-temperature adhesive tapes, maintaining performance above 300°C.
- CAS
- 25038-81-7
- HS Code
- 391190
- Grades
- film, moulding powder, varnish, carbon-filled
- Synonyms
- PI, polyimide, Kapton, 25038-81-7
Compliance
- · REACH-aligned supply
- · CLP-labelled